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    View The Printed Circuit Designer's Guide to—Stackups by Bill HarginPreview
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    The Printed Circuit Designer's Guide to—Stackups

    The Design within the Design, 2nd Edition

    by Bill Hargin

    This is the price your customers see. Edit list price

    Softcover
    Flexible, high-gloss laminated cover
    Quantity:
    About the Book

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    From material selection and understanding laminate datasheets, to impedance planning, glass weave skew and rigid-flex materials, topic expert Bill Hargin has written a unique book on PCB stackups.

    According to the author, “The difference between a high-speed PCB design that can be built, and a design that should be built, depends upon the backbone of the design itself: the stackup. The stackup touches every single high-speed signal and yet has had surprisingly little written about it.”

    While perhaps not the final word on the subject of stackups, this book is a good place to kick off a broader discussion of stackup planning and material selection in an effort to comprehend what Hargin calls, “the design within the design.”

    This book has been revised for accuracy as a 2nd edition.
    Features & Details

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    • Primary Category: Reference
    • Additional Categories Education
    • Project Option: 6×9 in, 15×23 cm
      # of Pages: 76
    • Isbn
      • Softcover: 9781959894018
    • Publish Date: Nov 22, 2022
    • Language English
    See More
    About the Creator
    I-007eBooks
    IPC Publishing Group, Inc.
    Bannockburn, IL

    IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

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    • © 2015 - 2025 RPI Print, Inc.
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