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    View The Printed Circuit Designer's Guide to: Thermal Management with Insulated Metal Substrates, Vol. 2 by D. Mauve and R. Art, VentecPreview
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    The Printed Circuit Designer's Guide to: Thermal Management with Insulated Metal Substrates, Vol. 2

    by D. Mauve and R. Art, Ventec

    This is the price your customers see. Edit list price

    Softcover
    Flexible, high-gloss laminated cover
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    About the Book

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    This book covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.

    Readers will learn the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary. One of the most pertinent questions answered is how to improve reliability of components as they become increasingly smaller.
    Features & Details

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    • Primary Category: Education
    • Project Option: 6×9 in, 15×23 cm
      # of Pages: 60
    • Isbn
      • Softcover: 9798985602050
    • Publish Date: Jul 25, 2022
    • Language English
    • Keywords PCBs, new product introduction, NPI
    See More
    About the Creator
    I-007eBooks
    IPC Publishing Group, Inc.
    Bannockburn, IL

    IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

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    • © 2015 - 2025 RPI Print, Inc.
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